july 2011 doc id 12640 rev 2 1/7 7 STPS1L20MF low drop power schottky rectifier in flat package features very low profile package: 0.85 mm backward compatible with standard stmite footprint very small conduction losses negligible switching losses extremely fast switching low forward voltage drop for higher efficiency and extended battery life low thermal resistance avalanche capability specified description single schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. packaged in stmite flat, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. due to the very small size of the package this device fits battery powered equipment (cellular, notebook, pda?s, printers) as well as chargers and pcmcia cards. table 1. device summary symbol value i f(av) 1 a v rrm 20 v t j (max) 150 c v f (max) 0.37 v k a stmite flat (do222-aa) www.st.com
characteristics STPS1L20MF 2/7 doc id 12640 rev 2 1 characteristics to evaluate the conduction losses use the following equation: p = 0.32 x i f(av) + 0.05 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 20 v i f(rms) forward current rms 2 a i f(av) average forward current t c = 140 c = 0.5 1 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 50 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 1400 w t stg storage temperature range - 65 to + 150 c t j maximum operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 150 c dv/dt critical rate of rise of reverse voltage (rated v r , t j = 25 c) 10000 v/s table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case 20 c/w r th(j-a) (1) 1. mounted with minimum recommended pad size, pc board fr4 junction to ambient 250 c/w table 4. static electrical characteristics symbol parameter tests co nditions min. typ. max. unit i r (1) 1. pulse test: = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm 0.015 0.075 ma t j = 85 c 0.90 4.50 t j = 25 c v r = 10 v 0.005 0.035 t j = 85 c 0.45 2.50 t j = 25 c v r = 5 v 0.003 0.025 t j = 85 c 0.30 1.60 v f (1) forward voltage drop t j = 25 c i f = 1 a 0.38 0.43 v t j = 85 c 0.32 0.37 t j = 25 c i f = 2 a 0.42 0.47 t j = 85 c 0.37 0.42 t j = 25 c i f = 3 a 0.46 0.53 t j = 85 c 0.42 0.49 t j = 25 c i f = 4 a 0.50 0.60 t j = 85 c 0.46 0.56 dptot dtj --------------- 1 rth j a ? () ------------------------- - <
STPS1L20MF characteristics doc id 12640 rev 2 3/7 figure 1. conduction losses versus average current figure 2. average forward current versus ambient temperature ( = 0.5) p (w) f(av) 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 = 0.05 = 0.1 = 0.2 = 0.5 = 1 t =tp/t tp i (a) f(av) i (a) f(av) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 25 50 75 100 125 150 r=r th(j-a) th(j-c) r =270c/w th(j-a) t (c) amb figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 p(t p ) p (1s) arm arm t (s) p 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 p(t) p (25 c) arm j arm t (c) j figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance junction to case versus pulse duration i (a) m 0 5 10 15 20 25 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 t(s) t =25c c t =75c c t =125c c z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 t =tp/t tp = 0.5 = 0.2 = 0.1 single pulse t (s) p
characteristics STPS1L20MF 4/7 doc id 12640 rev 2 figure 11. thermal resistance junction to ambient versus copper surface under tab (epoxy printed board fr4, copper thickness = 35 m, typical values) figure 7. reverse leakage currrent versus reverse voltage applied (typical values) figure 8. reverse leak age currrent versus junction temperature (typical values) figure 9. junction capacitance versus reverse voltage applied (typical values) figure 10. forward voltage drop versus forward current i (ma) r 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 2 4 6 8 101214161820 v (v) r t =125c j t =150c j t =100c j t =50c j t =25c j t =75c j 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 25 50 75 100 125 150 i (ma) r t (c) j v =20v r c(pf) 10 100 1000 1 10 100 v (v) r f=1mhz v =30mv t =25c osc rms j i (a) fm 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 v (v) fm t =25c (maximum values) j t =85c (maximum values) j t =85c (typical values) j r (c/w) th(j-a) 0 50 100 150 200 250 0 20 40 60 80 100 120 140 160 180 200 s(mm2)
STPS1L20MF package information doc id 12640 rev 2 5/7 2 package information epoxy meets ul94, v0 lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. stmite flat recommended footprint (all dimensions in mm) table 5. stmite flat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 d 1.75 1.90 2.05 0.069 0.075 0.081 e 3.60 3.80 3.90 0.142 0.150 0.154 e1 2.80 2.95 3.10 0.110 0.116 0.122 l 0.50 0.55 0.80 0.020 0.022 0.031 l1 2.10 2.40 2.60 0.083 0.094 0.102 l2 0.45 0.60 0.75 0.018 0.024 0.030 l3 0.20 0.35 0.50 0.008 0.014 0.020 e1 e c d b l3 a l l1 l2 b2 0.85 0.63 2.00 4.13 0.95 1.95 0.65 0.65
ordering information STPS1L20MF 6/7 doc id 12640 rev 2 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode STPS1L20MF f1l2 stmite flat 16 mg 12000 tape and reel table 7. document revision history date revision changes 21-aug-2006 1 first issue. 07-jul-2011 2 reformatted to current stand ards. updated caption for figure 6 .
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